2 Technical Forums and 1 Technical Salon, with the topics of “Electroplating Development in the Military and Chip Sectors”, “Chip Electroplating Chain – Focusing on New Development in High-End Electroplating Technology” and “Future Scientist Salon for Electroplating and Coating Application Industry” were held onsite, as part of the exhibition’s concurrent Technical Programmes. These events received enthusiastic responses from attendees, with a total of 940 participants. See below for more details.

Electroplating Development in the Military and Chip Sectors

Domestic military industry orders have multiplied in recent years under the requirements of national defense and military construction. The rising demand triggers electroplating processing companies to be more eager to enter the military products' processing circle. These companies face questions on how to complete training and certification on the quality, confidentiality system and integrity of military products, as well as what specific quality requirements aerospace and aviation industries have for surface treatment.

The Forum discussed how to strengthen and balance the supply and demand of the industry, at the same time to bridge the channels between military sector and electroplating processing enterprises.

Date：3^rd December, 2024 (Exhibition Day 1)

Time：14:00 – 16:00

Venue：Hall 5.1 – Booth No. 5.1H71

Topic	Presenting Unit	Speaker	Job Title
Engineering Applications of Water Repellent Treatment Technology and Super-Hydrophobic Coatings	School of Materials Science, Beihang University	Zhu Liqun	Professor
Electro-Deposition of Nano-Crystalline Zinc Coating and Application	Institute of Advanced Wear & Corrosion Resistant and Functional Materials, Jinan University	Li Qingyang	Deputy Researcher
Surface Treatment Waste Water Process Based on Source Control	Research Institute of Tsinghua University in Shenzhen	Wu Siguo	PhD.
Environmental Protection and Management Technology for the Chip Manufacturing Industry	School of Environmental Science and Engineering, Shanghai Jiao Tong University	Zhou Baoxue	Professor
Full Chain Solution for Electrochemical Sensing	School of Chemistry, Sun Yat-Sen University	Cui Guofeng	Professor

Chip Electroplating Chain – Focusing on New Development in High-End Electroplating Technology

With the rapid development of emerging electronic strategic industries such as Internet of Things, Artificial Intelligence, cloud computing, smart cars, smart homes and wearable devices, the demand for high-end electronic manufacturing represented by chip manufacturing is increasing. As the core technology of chip manufacturing, electronic plating has played an important role in the transition of chip manufacturing level. Nanometer level is the ultimate goal which assures the strategic security of the high-end chips.

The Forum explained in detail current status of industrial technology, future development trends and analyzed the impact of core technology upgrades and iterations of the electroplating industry.

Date：4^th December, 2024 (Exhibition Day 2)

Time：10:30 – 12:30

Venue：Hall 5.1 – Booth No. 5.1H71

Topic	Time	Presenting Unit	Speaker	Job Title
Research and Development of Cyanide-Free Gold Plating Technology for Advanced Semiconductors	10:30 - 11:00	Guangdong University of Technology	HAO Zhifeng	Professor
Electroplating Nanotwinned Copper and Its Applications in Advanced Packaging	11:00 - 11:30	Shenzhen Institutes of Advanced Technology Chinese Academy of Sciences	GAO Liyin	Associate Researcher
Research and Application of Hydrophilic Passivation Technology in Chip Thermal Management	11:30 - 12:00	Guangzhou Sanfu New Material Technology Co., Ltd. (Stock Code 688359)	LIU Ninghua	Senior Engineer
Study on Influencing Factors and Mechanisms of Whitening of Solder Masks on PCB Components	12:00 - 12:30	Shenzhen Kaifa Technology Co., Ltd. (Stock Code 000021)	ZHENG Xubin	Engineer

Future Scientist Salon for Electroplating and Coating Application Industry

To improve material performance, extend service life and achieve specific functions, plating and coating technologies are increasingly valued and widely used in various industries. This Salon explored technological innovation and market trends in the field of plating and coating, and promoted in-depth exchanges and cooperation between academia and the industry.

Date：4th December, 2024 (Exhibition Day 2) Time：14:00 – 16:00 Venue：Hall 5.1 – Booth No. 5.1H71

Thank for your support. Stay tuned for SFCHINA series of exhibition to bring similar events and presentations to the industry in the future.