2 Technical Forums, with the topics of “Growth Potential of Electroplating in the Military Sector” and “Chip Electroplating Chain – Focusing on New Development in High-End Electroplating Technology” are going to be held onsite, as part of the exhibition’s concurrent Technical Programme. See below for further details.

Growth Potential of Electroplating in the Military Sector

Domestic military industry orders have multiplied in recent years under the requirements of national defense and military construction. The rising demand triggers electroplating processing companies to be more eager to enter the military products' processing circle. These companies face questions on how to complete training and certification on the quality, confidentiality system and integrity of military products, as well as what specific quality requirements aerospace and aviation industries have for surface treatment.

The Organizer of the Technical Forum will try to answer these questions one by one, and will invite industry experts to discuss how to strengthen and balance the supply and demand of the industry, at the same time to bridge the channels between military sector and electroplating processing corporates.

Date   ：3^rd December, 2024 (Exhibition Day 1)

Time   ：14:00 – 16:00

Venue：Hall 5.1 – Booth No. 5.1H71

Language：Chinese (Putonghua)

Fee：Free of Charge

Registration：No Registration Required. Arrive at the Venue 15 Minutes Before and Provide your Business Card for Entry

Chip Electroplating Chain – Focusing on New Development in High-End Electroplating Technology

With the rapid development of emerging electronic strategic industries such as Internet of Things, Artificial Intelligence, cloud computing, smart cars, smart homes and wearable devices, the demand for high-end electronic manufacturing represented by chip manufacturing is increasing. As the core technology of chip manufacturing, electronic plating has played an important role in the transition of chip manufacturing level. Nanometer level is the ultimate goal which assures the strategic security of the high-end chips.

4 experts from university, electronic technology, scientific research institute and electroplating processing well-known enterprises will join this Technical Forum. They will focus on "Electronic Plating for Chip Manufacturing", and will explain in detail current status of industrial technology, future development trends, and analyze the impact of core technology upgrades and iterations on the electroplating industry.

Date   ：4^th December, 2024 (Exhibition Day 2)

Time   ：10:30 – 12:30

Venue：Hall 5.1 – Booth No. 5.1H71

Language：Chinese (Putonghua)

Fee：Free of Charge

Registration：No Registration Required. Arrive at the Venue 15 Minutes Before and Provide your Business Card for Entry

Detailed topics and list of speakers of each Technical Forum session will be announced soon. Please come back to visit this page closer to the time for further information.